1、 The concept of target materials
Target material, also known as sputtering target material, refers to the substance that is sputtered during the sputtering coating process. Sputtering is a material deposition method that accelerates the impact of charged particles (ions) on the surface of a target material, stripping the atoms or molecules from the surface and depositing them onto the substrate surface to form a thin film. The selection and quality of target materials have a crucial impact on the performance of thin films.
2、 Types of target materials
According to different classification methods, targets can be classified into various types.
Classified by material type: metal targets, alloy targets, ceramic targets, composite targets, etc.
Classified by purity: high-purity target materials, ultra-high purity target materials, etc.
Classified by purpose: optical thin film targets, magnetic thin film targets, conductive thin film targets, etc.
3、 Application of target materials
Target materials are widely used in many fields, such as:
Display field: such as liquid crystal displays (LCDs), organic light-emitting diodes (OLEDs), etc.
Solar cells: such as silicon-based, thin-film solar cells, etc.
Magnetic storage: such as hard drives, magnetic cards, etc.
Microelectronic devices: such as integrated circuits, semiconductor devices, etc.
Optical components: such as reflectors, filters, etc.
Biomedicine: such as biosensors, drug release control, etc.
4、 Preparation method of target materials
The preparation methods of target materials mainly include the following:
Melting casting method: Heating metal or alloy materials to a molten state, then casting, cooling, and demolding to obtain the target material.
Hot pressing method: Apply pressure to powdered raw materials at high temperatures to melt and form them.
Sintering method: The powdered raw materials are formed and high-temperature sintered to form target materials with certain strength and shape
Sputtering method: Using sputtering technology to sputter raw materials onto the surface of another target material, forming the desired thin film target material.
Chemical vapor deposition (CVD): Depositing the required material on the surface of the target material through chemical reactions.
Electrolysis method: Using current to pass through a solution, metal ions in the solution are deposited on the anode to form a target material.
5、 Summary
Titanium targets, as the material being sputtered during the sputtering process, have a wide variety of types and applications, covering multiple fields such as displays, solar cells, magnetic storage, microelectronic devices, optical components, etc. The quality of the target material has a significant impact on the performance of the thin film, therefore selecting the appropriate target material and preparation method is crucial. In the future development of technology, target technology will continue to play an important role in promoting continuous innovation and breakthroughs in various fields of technology.